Electronic package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorChung-Yuan TSAI
Life of this patent
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Abstract
An electronic package and method for manufacturing the same are provided. The electronic package includes a first conductive structure, a second conductive structure, an electronic component, an underfill and a dam structure. The second conductive structure is disposed on the first conductive structure, wherein the second conductive structure defines a cavity over the first conductive structure. The electronic component is disposed on the first conductive structure and at least partially disposed in the cavity. The underfill is disposed between the first conductive structure and the electronic component. The dam structure is disposed on the first conductive structure and configured to confine the underfill.
Claims20
An electronic package, comprising:
- a first conductive structure;
- a second conductive structure disposed on the first conductive structure, wherein the second conductive structure defines a cavity over the first conductive structure;
- an electronic component disposed on the first conductive structure and at least partially disposed in the cavity;
- an underfill disposed between the first conductive structure and the electronic component;
- and
- a dam structure disposed on the first conductive structure and configured to confine the underfill.
An electronic package, comprising:
- a first conductive structure;
- a second conductive structure disposed on the first conductive structure, wherein the second conductive structure defines a cavity over the first conductive structure;
- an electronic component disposed on the first conductive structure and at least partially disposed in the cavity;
- and
- a stress compensation layer disposed on the cavity.
A method of manufacturing an electronic package, comprising:
- providing a first conductive structure including a dam structure on a surface of the first conductive structure;
- bonding an electronic component to the surface of the first conductive structure in a space defined by the dam structure;
- dispensing an underfill between the electronic component and the first conductive structure and constraining the underfill in the space by the dam structure;
- providing a second conductive structure including a cavity;
- and
- disposing the second conductive structure on the first conductive structure with the cavity receiving the electronic component.
Dependencies are inferred from the claim text.