Dummy die in a recessed mold structure of a packaged integrated circuit device

A method comprising:

• coupling an integrated circuit (IC) die to a first region of a substrate;
• forming a first package mold structure on a second region of the substrate, wherein the first package mold structure is adjacent to the IC die;
• forming a recess structure which extends into the first package mold structure;
• forming a dummy die structure on a bottom of the recess structure, the dummy die structure comprising:
• a polymer resin and a filler;
• or
• a metal having a coefficient of thermal expansion (CTE) which is less than 12 parts per million per degree Kelvin (ppm/° K);
• and
• after forming the dummy die structure, forming a second package mold structure adjacent to the first package mold structure and adjacent to the IC die, wherein the second package mold structure extends to the recess structure.

A system comprising:

• a packaged device comprising:
• a substrate;
• an integrated circuit (IC) die coupled to a first region of the substrate;
• a first package mold structure adjacent to the IC die and coupled to a second region of the surface, wherein a recess structure is formed with the first package mold structure;
• a dummy die structure on a bottom of the recess structure, the dummy die structure comprising:
• a polymer resin and a filler;
• or
• a metal having a coefficient of thermal expansion (CTE) which is less than 12 parts per million per degree Kelvin (ppm/° K);
• and
• a second package mold structure adjacent to the first package mold structure and adjacent to the IC die, wherein the second package mold structure extends to the recess structure;
• and
• a display device coupled to the packaged device, the display device to display an image based on a signal communicated with the IC die.