Semiconductor substrate and semiconductor module

Abstract

Provided is a protection structure that appropriately protects a side surface of a glass substrate in a semiconductor module. A semiconductor module is provided with a glass substrate. The glass substrate is provided with a plurality of straight line portions and a corner portion interposed between the straight line portions on a side surface thereof. A protective material is formed on at least a part of the side surface of the glass substrate. The corner portion of the glass substrate is located on an inner side of a straight line connecting ridges of protective materials formed on the straight line portions (a center side of the glass substrate). Therefore, the corner portion is protected against an impact on the side surface of the glass substrate.

Dependencies are inferred from the claim text.