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US 2022/0102229 A1Published application
Composite substrate and method of producing the composite substrate, and semiconductor device comprising the composite substrate
AssigneeNichia Corporation
InventorsMasatsugu ICHIKAWA, Shoichi YAMADA, Takeshi KIHARA, Yutaka MATSUSAKA
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Abstract
A composite substrate includes a base layer formed of a composite material containing diamond and a metal, the base layer a first surface, and a second surface opposite to the first surface; a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and an insulating layer directly bonded to the upper surface of the flat layer.
Claims16
A composite substrate comprising:
- a base layer formed of a composite material containing diamond and a metal, the base layer having a first surface, and a second surface opposite to the first surface;
- a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less;
- and
- an insulating layer directly bonded to the upper surface of the flat layer.
1 more element
A method of producing a composite substrate, the method comprising:
- providing a layered body comprising:
- a base layer formed of a composite material containing diamond and a metal, the base layer having a first surface, and a second surface opposite to the first surface, and
- a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less;
- and
- directly bonding an insulating layer to the upper surface of the flat layer.
2 more elements
Dependencies are inferred from the claim text.