Electronic power unit and semiconductor power module

An electronic power unit (1), comprising:

• a substrate (10) having a perpendicular direction (N) and a flat insulating molded body (2) and with a metal layer (3) on its first main face (20) and a plurality of conductor tracks (40, 42) on its second main face (22);
• a first and a second fastening device (50, 60) and at least one of said first and said second fastening devices (50, 60) is adaptively embodied as a cylindrical cut-out;
• the substrate (10) is arranged in at least one of a non-positive locking and a materially-bonded manner on a base plate (5) of the electronic power unit;
• the first fastening device (50) is provided so as to arrange the base plate (5) in said non-positive locking manner on a cooling device;
• a housing section (600) has said second fastening device (60) so as to arrange the substrate (10) in said non-positive locking manner on said cooling device;
• wherein an edge (300) of the metal layer (3) is offset to a rear with respect to an edge (200) of the insulating molded body (2);
• and
• wherein in a region adjacent to at least one of the first and the second fastening devices (50, 60) a first edge section (301) of the edge of the metal layer (3) is offset to the rear further than in each case adjoining respective second and third edge sections (302, 303) of the edge (300) of the metal layer (3).