Apparatus and method for bonding a plurality of dies to a carrier panel

A die bonder for bonding a plurality of semiconductor dies from a diced wafer to a carrier panel, comprising:

• a support structure having a base support surface for resting on a surface to which the die bonder is supported;
• a wafer feed unit configured to erect the diced wafer with a wafer surface thereof substantially vertical with respect to the base support surface;
• a die bond unit having a carrier holder configured to hold the carrier panel with a bonding surface thereof substantially vertical with respect to the base support surface;
• a die transfer module disposed between the wafer feed unit and the die bond unit, the die transfer module being configured to transfer the plurality of dies from the diced wafer to the carrier panel;
• and
• a vision system for observing operation of the die bonder to provide feedback for controlling the wafer feed unit, the die bond unit and the die transfer module.

A method of bonding a plurality of dies to a carrier panel with a die bonder, comprising

• picking a die, via a die transfer module of the die bonder, from a diced wafer held by a wafer feed unit of the die bonder having a wafer holder holding the diced wafer in a manner so as to space the diced wafer apart from a carrier panel held by a carrier support unit of the die bonder and orient the diced wafer with an exposed surface of the diced wafer facing a bonding surface of the carrier panel;
• and
• placing the die, via the die transfer module, on the bonding surface of the carrier panel held by the carrier support unit for bonding the die to the bonding surface of the carrier panel,
• wherein the die transfer module is disposed between the carrier support unit and the wafer feed unit.