Wafer processing device and wafer conveying method

A wafer processing device, comprising:

• a bearing plate, wherein a through hole is formed in the bearing plate, and the bearing plate is configured to bear a wafer;
• a drive base liftable relative to the bearing plate;
• a lifting rod arranged between the bearing plate and the drive base, wherein an end of the lifting rod is in contact with the drive base, and the drive base drives the lifting rod to ascend and descend in the through hole, so that an another end of the lifting rod acts on a bottom surface of the wafer through the through hole, to separate the wafer from the bearing plate;
• an electromagnetic conversion device arranged on the drive base, wherein the electromagnetic conversion device generates a magnetic force after being powered on;
• and
• a magnetic element arranged at an end, close to the drive base, of the lifting rod, wherein after the electromagnetic conversion device generates the magnetic force, the electromagnetic conversion device adsorbs the magnetic element, and when the drive base descends, a pulling force is applied to the lifting rod.