Wafer placement table and method of manufacturing the same
AssigneeNGK Insulators, Ltd.
InventorsHiroshi TAKEBAYASHI, Kenichiro AIKAWA, Tatsuya KUNO
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Abstract
A wafer placement table is a ceramic sintered body with a surface provided with multiple projections that support a wafer. Of the surface of the ceramic sintered body, the area provided with no projection is a mirror surface which has a surface roughness Ra of 0.1 μm or less. The projections are formed of an aerosol deposition film or a thermal spray film made of the same material as for the ceramic sintered body.
Claims4
A wafer placement table which is a ceramic sintered body with a surface provided with multiple projections that support a wafer,
- wherein of the surface of the ceramic sintered body, an area provided with no projection is a mirror surface which has a surface roughness Ra of 0.1 μm or less, and
- the projections are formed of an aerosol deposition film or a thermal spray film made of the same material as for the ceramic sintered body.
A method of manufacturing a wafer placement table, the method comprising:
- (a) step of mirror-finishing a surface of a ceramic sintered body;
- and
- (b) step of forming projections by an aerosol deposition method or a thermal spray method on a section of the surface, on which the projections are desired to be formed.
Dependencies are inferred from the claim text.