Semiconductor manufacturing apparatus including bonding head

A semiconductor manufacturing apparatus configured to bond a substrate to a semiconductor chip, the semiconductor manufacturing apparatus comprising:

• a support configured to mount the substrate on a main surface of the support;
• and
• a bonding head configured to transfer the semiconductor chip to stack the semiconductor chip on the substrate,
• wherein the bonding head comprises:
• an attachment pad configured to attach to the semiconductor chip;
• and
• a tilting movement actuator configured to tilt the attachment pad around a tilting axis extending in a direction parallel to the main surface of the support and comprising an actuator.

A semiconductor manufacturing apparatus comprising:

• a loading stage configured to load a ring frame on which a semiconductor chip is mounted;
• a loading/unloading stage for loading and unloading a substrate;
• a chip separation stage configured to reduce adhesion of an adhesive film of the ring frame supporting the semiconductor chip;
• a bonding stage configured to perform a bonding process between the substrate and the semiconductor chip, the bonding stage comprising:
• a support having a main surface configured to receive the substrate;
• and a bonding head configured to stack the semiconductor chip on the substrate mounted on the support;
• and
• a chip transfer module configured to transfer the semiconductor chip from the chip separation stage toward the bonding head,
• wherein the bonding head comprises:
• an attachment pad comprising a bottom surface configured to attach to the semiconductor chip and a cavity provided in the attachment pad, and
• an air pressure adjuster configured to inject or exhaust air into or from the cavity of the attachment pad, such that the pressure of air in the cavity of the attachment pad is adjusted.