Electrostatic chuck and semiconductor manufacturing apparatus
AssigneeToto Ltd.
InventorsAkihito ONO, Jumpei UEFUJI
Life of this patent
Estimating the term…
Abstract
An electrostatic chuck includes a ceramic dielectric substrate; a base plate; and a heater unit heating the ceramic dielectric substrate. The heater unit includes a first heater element. The first heater element has a plurality of sub-zones and a plurality of cooling gas holes. The sub-zones are separated from each other in a circumferential direction. The cooling gas holes are provided in the sub-zones. The cooling gas holes are disposed in the circumferential direction and are provided at positions where the cooling gas holes do not overlap a boundary in the circumferential direction between the sub-zones in a Z-direction perpendicular to the first major surface.
Claims8
An electrostatic chuck comprising:
- a ceramic dielectric substrate having a first major surface configured to have a process object mounted thereon and a second major surface on a side opposite to the first major surface;
- a base plate supporting the ceramic dielectric substrate;
- and
- a heater unit which heats the ceramic dielectric substrate, wherein
- the heater unit includes a first heater element,
- the first heater element having a plurality of sub-zones separated from each other in a circumferential direction and a plurality of cooling gas holes provided in the sub-zones with a cooling gas for cooling the process object being able to pass through the plurality of cooling gas holes, and
- the cooling gas holes being disposed in the circumferential direction and are provided at positions where the cooling gas holes do not overlap a boundary in the circumferential direction between the sub-zones in a Z-direction perpendicular to the first major surface.
An electrostatic chuck comprising:
- a ceramic dielectric substrate having a first major surface configured to have a process object mounted thereon and a second major surface on a side opposite to the first major surface;
- a base plate supporting the ceramic dielectric substrate;
- and
- a heater unit which heats the ceramic dielectric substrate, wherein
- the heater unit includes a first heater element,
- the first heater element having a plurality of sub-zones separated from each other in a circumferential direction and a plurality of lift pin holes provided in the sub-zones with a lift pin for supporting the process object being able to pass through the plurality of lift pin holes, and
- the lift pin holes being disposed in the circumferential direction and being provided at positions where the lift pin holes do not overlap a boundary in the circumferential direction between the sub-zones in a Z-direction perpendicular to the first major surface.
Dependencies are inferred from the claim text.