Electrostatic chuck and semiconductor manufacturing apparatus

An electrostatic chuck comprising:

• a ceramic dielectric substrate having a first major surface configured to have a process object mounted thereon and a second major surface on a side opposite to the first major surface;
• a base plate supporting the ceramic dielectric substrate;
• and
• a heater unit which heats the ceramic dielectric substrate, wherein
• the heater unit includes a first heater element,
• the first heater element having a plurality of sub-zones,
• the sub-zones including a first sub-zone including an outer peripheral edge of the first heater element,
• the first sub-zone having a sub-heater line generating heat by allowing a current to flow, a first sub-power feeding portion feeding a power to the sub-heater line, and a second sub-power feeding portion feeding a power to the sub-heater line,
• the first sub-zone having an inner circumference portion located inside a center line of a radial direction dividing the first sub-zone into two equal zones in the radial direction and an outer circumference portion including the outer peripheral edge located outside the center line of the radial direction in the radial direction, and
• at least one of the first sub-power feeding portion and the second sub-power feeding portion being provided in the inner circumference portion.