Wafer supporting mechanism and method for wafer dicing
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsBo Hua CHEN, Yan Ting SHEN, Fu Tang CHU, Wen-Pin HUANG
Life of this patent
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Abstract
A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.
Claims20
A wafer supporting mechanism, comprising:
- a base portion comprising a first gas channel and a first outlet connected to the first gas channel;
- and
- a support portion connected to the base portion and comprising a second gas channel connected to the first gas channel;
- wherein an accommodation space is defined by the base portion and the support portion.
A wafer supporting mechanism, comprising:
- a cavity table, comprising:
- a base plate;
- a first support wall connected to the base plate;
- and
- a first gas channel in the first support wall, configured to align to a peripheral region of a wafer, an accommodation space defined by the base plate and an inner sidewall of the support wall.
A method for wafer dicing, comprising:
- providing a wafer supporting mechanism comprising a gas channel and a first outlet connected to the gas channel, the gas channel having at least second outlet;
- providing a wafer comprising a plurality of semiconductor devices on a first surface of the wafer;
- disposing the wafer on the wafer supporting mechanism to cover the open terminal of the gas channel;
- fixating the wafer to the wafer supporting mechanism by exhausting gas from the gas channel through the first outlet;
- and
- dicing the wafer.
Dependencies are inferred from the claim text.