Method of determining a critical temperature of a semiconductor package and apparatus for performing the same

An apparatus for determining a critical temperature of a semiconductor package, the apparatus comprising:

• a heater configured to apply heat to the semiconductor package;
• a temperature sensor configured to measure temperatures of the semiconductor package during application of the heat;
• a height sensor configured to measure heights of the semiconductor package during application of the heat;
• and
• a controller configured to determine a temperature from among the measured temperatures of the semiconductor package at a point at which a height of the semiconductor package is sharply increased so that swelling of the semiconductor package occurs as the critical temperature of the semiconductor package.

An apparatus for determining critical temperatures of a plurality of semiconductor packages, the apparatus comprising:

• a plurality of heaters configured to apply heat to the plurality of the semiconductor packages;
• a plurality of temperature sensors configured to measure temperatures of the plurality of semiconductor packages during application of the heat;
• a plurality of first actuators configured to move the plurality of temperature sensors along a first horizontal direction and a second horizontal direction substantially perpendicular to the first horizontal direction;
• a height sensor module configured to scan the plurality of semiconductor packages along the first horizontal direction or the second horizontal direction to measure heights of the plurality of semiconductor packages during application of the heat;
• a second actuator configured to move the height sensor module along the first horizontal direction and the second horizontal direction;
• and
• a controller configured to determine temperatures from among the measured temperatures of each of the plurality of semiconductor packages at points at which heights from among the measured heights of the plurality of semiconductor packages are sharply increased so that swelling occurs as the critical temperatures of the plurality of semiconductor packages.