Substrate treating apparatus
AssigneeSemes Co., Ltd.
InventorsJae Oh BANG, Jong Gun LEE
Life of this patent
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Abstract
The inventive concept provides a substrate treating apparatus. In an embodiment, the substrate treating apparatus includes a process chamber having a treatment space, a support unit that supports a substrate in the treatment space, and a supply line that supplies a process gas into the treatment space, and the support unit includes a heating plate provided with a heater pattern on a lower surface thereof and that heats the supported substrate, and an insulation layer covering the heater pattern and the lower surface of the heating plate.
Claims13
A substrate treating apparatus comprising:
- a process chamber having a treatment space;
- a support unit configured to support a substrate in the treatment space;
- and
- a supply line configured to supply a process gas into the treatment space,
- wherein the support unit includes:
- a heating plate provided with a heater pattern on a lower surface thereof and configured to heat the supported substrate;
- and
- an insulation layer covering the heater pattern and the lower surface of the heating plate.
A substrate treating apparatus comprising:
- a process chamber having a treatment space;
- a support unit configured to support a substrate in the treatment space;
- and
- a supply line configured to supply a process gas including moisture into the treatment space,
- wherein the support unit includes:
- a heating plate having a diameter that is larger than a diameter of the substrate supported in a plane aspect, provided with a heater pattern on a lower surface thereof, and configured to heat the supported substrate;
- and
- an insulation layer having a diameter corresponding to the heating plate, covering the heater pattern and the lower surface of the heating plate, and including an epoxy molding compound,
- wherein, with respect to a total of 100 wt % of the epoxy molding compound of the insulation layer, the epoxy molding compound includes:
- an inorganic filter of 65 to 88 wt %;
- an epoxy resin of 7 to 30 wt %;
- an epoxy resin hardener of 2 to 13 wt %;
- and
- an additive of 1.25 to 3 wt %,
- wherein the inorganic filler has particles of sizes of 2 to 30 μm, and has, with respect to the inorganic filler of 100 wt %, 20 to 35 wt % of particles having an average particle diameter of 5 μm or less and 65 to 80 wt % of particles having an average particle diameter of more than 5 μm,
- wherein the heating plate has a thickness of 1 to 2 mm, and
- wherein the insulation layer has a thickness of 2 to 3 mm.
Dependencies are inferred from the claim text.