Planarization process, planarization system and method of manufacturing an article

A planarization system, comprising:

• a substrate chuck configured to hold a substrate;
• a superstrate chuck configured to hold a superstrate;
• a positioning stage;
• a dispensing system configured to dispense formable material on the substrate;
• a planarizing station configured to contact, at a first location, the dispensed formable material on the substrate with the superstrate to form a multilayer structure including the superstrate, a film of the formable material, and the substrate;
• and
• a curing station located at a second location away from the first location, the curing station including an array of light-emitting diodes,
• wherein the superstrate chuck is further configured to release the superstrate,
• wherein the positioning stage is configured to move the multilayer structure from the planarizing station to the curing station after the superstrate has been released, and
• wherein, when the multilayer structure is located at the curing station, the curing station is configured to cure the film of the multilayer structure by exposing the film to light emitted from the array of light-emitting diodes.

A method of manufacturing an article, comprising:

• dispensing formable material onto a substrate;
• contacting, at a planarizing station at a first location, a superstrate held by a superstrate chuck with the formable material on the substrate, thereby forming a multilayer structure including the superstrate, a film of the formable material, and the substrate;
• releasing the superstrate from the superstrate chuck;
• moving the multilayer structure from the first location to a curing station located at a second location away from the first location, the curing station including an array of light-emitting diodes;
• and
• curing the film of the multilayer structure by exposing the film to light emitted from the array of light-emitting diodes;
• and
• processing the cured film to make the article.