Leadframe package with pre-applied filler material
AssigneeSTMicroelectronics S.r.l.
InventorsJefferson Talledo, Frederick Ray Gomez
Life of this patent
Estimating the term…
Abstract
Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.
Claims18
A method, comprising:
- forming a conductive layer in a plurality of recesses of a plurality of leads of a leadframe, the plurality of leads having first surfaces and lands opposite the first surfaces, the plurality of recesses being proximate the lands;
- attaching a semiconductor die to a surface of a die pad that is spaced from the plurality of leads;
- using a plurality of conductive elements, electrically coupling the semiconductor die to the first surfaces of the plurality of leads;
- encapsulating the semiconductor die and the plurality of conducive elements in an encapsulation material;
- and
- after the encapsulating, filling the plurality of recesses with a conductive filler material.
A method, comprising:
- forming a conductive layer in a recess of a leadframe, wherein the recess is formed in first and second leads that are adjacent to each other and coupled together;
- attaching a first semiconductor die to a first die pad;
- attached a second semiconductor die to a second die pad;
- electrically coupling the first semiconductor die to the first lead;
- electrically coupling the second semiconductor die to the second lead;
- forming an encapsulation material around the first semiconductor die and the second semiconductor die;
- substantially filling a recess in a leadframe with a conductive filler material, wherein the conductive filler material has a melting temperature that is less than a melting temperature of the conductive layer, wherein the recess is formed in first and second leads that are adjacent to each other and coupled together;
- and
- cutting through the encapsulation material, the conductive filler material, the conductive layer, and the first and second leads to separate the first lead from the second lead.
A method, comprising:
- forming a conformal conductive layer in a plurality of recesses of a plurality of leads;
- attaching a semiconductor die to a surface of a die pad that is spaced from the plurality of leads;
- electrically coupling the semiconductor die to the plurality of leads;
- encapsulating the semiconductor die to form a semiconductor package;
- and
- filling only portions of the plurality of recesses of the plurality of leads with a conductive filler material, wherein the conductive filler material is a material having a melting temperature that is less than a melting temperature of the conductive layer.
Dependencies are inferred from the claim text.