Planarization apparatus, planarization process, and method of manufacturing an article
AssigneeCanon Kabushiki Kaisha
InventorXiaoming Lu
Life of this patent
Estimating the term…
Abstract
A planarization apparatus, including a chuck having a first surface and a second surface at two opposing sides thereof. The chuck includes a first zone extending along a periphery of the chuck, a second zone at an inner portion of the chuck, the second zone being surrounded by the first zone; and a flexure connecting the first zone with the second zone. The first zone includes a first member extending along the first surface from the flexure and a first ring land protruding from the first member adjacent to the flexure.
Claims22
A planarization apparatus, comprising:
- a chuck having a first surface and a second surface at two opposing sides thereof, the chuck including:
- a first zone extending along a periphery of the chuck;
- and
- a second zone at an inner portion of the chuck, the second zone being surrounded by the first zone;
- wherein the first zone includes:
- a first member extending along the first surface from an edge of the second zone, the first member is configured bendable independently from the middle zone;
- and
- a first ring land protruding from the first member.
A planarization process, comprising:
- retaining a superstrate with a chuck, wherein the chuck includes a first zone and a second zone, the second zone being surrounded by the first zone bendable independently from the first zone;
- advancing the superstrate in contact with a formable material dispensed on a wafer;
- generating a curvature of the superstrate by applying pressure to the second zone;
- and
- controlling a movement of the first zone about a location between the first zone and the second zone towards the superstrate.
A method of manufacturing an article, comprising:
- retaining a superstrate with a chuck, the chuck including a first zone and a second zone, the second zone being surrounded by the first zone, and first zone being bendable about a point between the first zone and the second zone independently;
- advancing the superstrate towards a formable material formed on a wafer;
- controlling a curvature of the superstrate for spreading the formable material by generating a curvature of the superstrate by applying pressure to the second zone;
- controlling a contact line moving velocity by controlling a movement of the first zone about the point towards the superstrate;
- and
- solidifying the formable material before or after the chuck is separated from the superstrate;
Dependencies are inferred from the claim text.