Device and method for bonding of substrates
AssigneeEV Group E. Thallner GmbH
InventorsThomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Abstract
A method and a corresponding device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates. The method includes holding of the first substrate to a first holding surface of a first holding device and holding of the second substrate to a second holding surface of a second holding device. A change in curvature of the contact face of the first substrate and/or a change in curvature of the contact face of the second substrate are controlled during the bonding.
Claims17
A method for bonding substrates comprising:
- providing a first substrate having a contact face and a second substrate having a contact face;
- holding the first substrate to a first holding surface of a first holding device having a plurality of fixing elements;
- holding the second substrate to a second holding surface of a second holding device having a plurality of fixing elements,
- wherein the contact face of the first substrate faces the contact face of the second substrate;
- bonding the first substrate with the second substrate at the contact faces of the first and second substrates;
- and
- controlling during the bonding a change in a curvature of the contact face of the first substrate and/or controlling a change in a curvature of the contact face of the second substrate, said controlling including
- using a plurality of distance sensors distributed along at least one of the first holding surface or the second holding surface to detect curvatures of the first and/or second substrates and/or change in the curvatures of the first and/or second substrates, and
- selectively releasing at least one fixing element of the first and/or second holding surfaces based on
- i) the detected curvature of the first substrate and/or the detected curvature of the second substrate, respectively, and/or
- ii) the detected change in curvature of the first substrate and/or the detected change in curvature of the second substrate, respectively
- to achieve a target curvature of the contact face of the first substrate and/or a target curvature of the contact face of the second substrate.
A device for bonding a first substrate with a second substrate at mutually facing contact faces of the first and second substrates, said device comprising:
- a first holding device including a plurality of fixing elements for holding the first substrate to a first holding surface;
- a second holding device including a plurality of fixing elements for holding the second substrate to a second holding surface;
- a plurality of distance sensors distributed along at least one of the first holding surface or the second holding surface;
- a curvature changing device for changing a curvature of the first substrate and/or for changing the curvature of the second substrate, said curvature changing device controlling the change of curvature of the first substrate and/or the second substrate during the bonding of the first substrate with the second substrate;
- and
- a controller operatively coupled to the first and second holding devices, the plurality of distance sensors, and the curvature changing device, the controller configured to
- detect, based on data obtained from the distance sensors, curvatures of the first and/or second substrates and/or change in the curvatures of the first and/or second substrates,
- selectively release at least one fixing element of the first and/or second holding surfaces based on
- i) the detected curvature of the first substrate and/or the detected curvature of the second substrate, respectively, and/or
- ii) the detected change in curvature of the first substrate and/or the detected change in curvature of the second substrate, respectively
- to achieve a target curvature of the contact face of the first substrate and/or a target curvature of the contact face of the second substrate.
Dependencies are inferred from the claim text.