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US 2022/0102074 A1Published application
Electronic component and board having the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsMi Na Hyun, Beom Joon Cho, Ki Young Kim
Life of this patent
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Abstract
An electronic component includes: a capacitor body; a pair of external electrodes disposed on opposite end surfaces of the capacitor body, respectively; and a pair of metal frames connected to the pair of external electrodes, respectively. A coefficient of thermal expansion of the pair of metal frames has a value between a coefficient of thermal expansion of the capacitor body and a coefficient of thermal expansion of a solder.
Claims18
An electronic component comprising:
- a capacitor body;
- a pair of external electrodes disposed on opposite end surfaces of the capacitor body, respectively;
- and
- a pair of metal frames connected to the pair of external electrodes, respectively,
- wherein a coefficient of thermal expansion of the pair of metal frames has a value between a coefficient of thermal expansion of the capacitor body and a coefficient of thermal expansion of a solder.
2 more elements
Aboard having an electronic component, comprising
- a circuit board having a plurality of electrode pads disposed on an upper surface thereof;
- an electronic component mounted on the circuit board and including a pair of metal frames connected to the plurality of electrode pads, respectively;
- and
- solders connecting the plurality of electrode pads to the pair of metal frames, respectively,
- wherein the electronic component further includes:
- a capacitor body;
- and
- a pair of external electrodes disposed on opposite end surfaces of the capacitor body, respectively, and connected to the pair of metal frames, respectively, and
- a coefficient of thermal expansion of the pair of metal frames has a value between a coefficient of thermal expansion of the capacitor body and a coefficient of thermal expansion of the solders.
6 more elements
Dependencies are inferred from the claim text.