Stepped coax mil pths for modulating inductance within a package
AssigneeIntel Corporation
InventorsBrandon C. MARIN, Krishna BHARATH, Haifa HARIRI, Tarek A. IBRAHIM
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Abstract
Embodiments disclosed herein include electronic packages with embedded inductors and methods of forming such electronic packages. In an embodiment, the electronic package comprises a package core, and a plated through hole (PTH) through a thickness of the package core. In an embodiment, the electronic package further and a magnetic shell around a perimeter of the PTH, where a height of the magnetic shell is less than the thickness of the package core. In an embodiment, the magnetic shell comprises a substantially vertical sidewall and a bottom surface that is tapered.
Claims25
An electronic package, comprising:
- a package core;
- a plated through hole (PTH) through a thickness of the package core;
- and
- a magnetic shell around a perimeter of the PTH, wherein a height of the magnetic shell is less than the thickness of the package core.
An electronic package, comprising:
- a package core;
- a plurality of routing layers above and below the package core;
- and
- an inductor embedded in the package core and the plurality of routing layers, wherein the inductor comprises:
- a first plated through hole (PTH), wherein the first PTH passes through first routing layers above the package core and through the package core;
- a second PTH, wherein the second PTH passes through the first routing layers above the package core and through the package core;
- a first magnetic shell around the first PTH;
- a second magnetic shell around the second PTH;
- and
- a trace in a second routing layer below the package core, wherein the trace electrically couples the first PTH to the second PTH.
A method of forming an inductor in an electronic package, comprising:
- providing a package core;
- drilling a first hole with a first diameter into the package core, wherein a bottom of the first hole is V-shaped;
- filling the first hole with a magnetic material;
- drilling a second hole with a second diameter through the magnetic material and through an entire thickness of the package core, wherein the second diameter is smaller than the first diameter;
- and
- plating a conductive layer along sidewalls of the second hole.
An electronic system, comprising:
- a board;
- and
- an electronic package coupled to the board, wherein the electronic package comprises:
- a package core;
- a plated through hole (PTH) through a thickness of the package core;
- and
- a magnetic shell around a perimeter of the PTH, wherein a height of the magnetic shell is less than the thickness of the package core.
Dependencies are inferred from the claim text.