Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
AssigneeKokusai Electric Corporation
InventorsSusumu NISHIURA, Kenichi MAEDA, Hiroyuki KITAMOTO, Hajime ABIKO
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AssigneeKokusai Electric Corporation
InventorsSusumu NISHIURA, Kenichi MAEDA, Hiroyuki KITAMOTO, Hajime ABIKO
Estimating the term…
There is provided a configuration that includes: at least one transfer mechanism configured to transfer a substrate and at least one processing mechanism configured to process the substrate; an earthquake detector configured to detect an earthquake; and a controller configured to control the at least one transfer mechanism and the at least one processing mechanism according to a detection result of the earthquake detector, wherein the controller is configured to be capable of performing a stopping operation of the at least one transfer mechanism according to a P wave (initial tremor wave) and an S wave (principal fluctuation wave).
A substrate processing apparatus comprising:
A method of manufacturing a semiconductor device, comprising:
A non-transitory computer-readable recording medium storing a program that causes a controller to perform a process, wherein the program is executed in a substrate processing apparatus including at least one transfer mechanism configured to transfer a substrate, at least one processing mechanism configured to process the substrate, an earthquake detector configured to detect an earthquake, and the controller configured to control the at least one transfer mechanism and the at least one processing mechanism according to a detection result of the earthquake detector, the controller being configured to be capable of performing a stopping operation of the at least one transfer mechanism according to a P wave (initial tremor wave) and an S wave (principal fluctuation wave), the process comprising:
Dependencies are inferred from the claim text.