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US 2022/0098404 A1Published application
Thermosetting resin composition, resin sheet, laminate, and printed wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKouichi AOKI, Tomoyuki AOKI, Eiichiro SAITO
Life of this patent
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Abstract
The thermosetting resin composition contains a radical polymerizable unsaturated compound and an organic radical compound.
Claims20
A thermosetting resin composition comprising:
- a radical polymerizable unsaturated compound (A);
- and
- an organic radical compound (C).
Dependencies are inferred from the claim text.