Fabrication of gate-all-around integrated circuit structures having additive metal gates
AssigneeIntel Corporation
InventorsDan S. LAVRIC, Dax M. CRUM, Omair SAADAT, Oleg GOLONZKA, Tahir GHANI
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AssigneeIntel Corporation
InventorsDan S. LAVRIC, Dax M. CRUM, Omair SAADAT, Oleg GOLONZKA, Tahir GHANI
Estimating the term…
Gate-all-around integrated circuit structures having additive metal gates are described. For example, an integrated circuit structure includes a first vertical arrangement of horizontal nanowires, and a second vertical arrangement of horizontal nanowires. A first gate stack is over the first vertical arrangement of horizontal nanowires, the first gate stack having a P-type conductive layer with a first portion surrounding the nanowires of the first vertical arrangement of horizontal nanowires and a second portion extending laterally beside and spaced apart from the first portion. A second gate stack is over the second vertical arrangement of horizontal nanowires, the second gate stack having an N-type conductive layer with a first portion surrounding the nanowires of the second vertical arrangement of horizontal nanowires and a second portion adjacent to and in contact with the second portion of the P-type conductive layer.
An integrated circuit structure, comprising:
An integrated circuit structure, comprising:
A computing device, comprising:
A computing device, comprising:
Dependencies are inferred from the claim text.