Fabrication of gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer
AssigneeIntel Corporation
InventorsDaniel G. OUELLETTE, Daniel B. O'BRIEN, Jeffrey S. LEIB, Orb ACTON, Lukas BAUMGARTEL, Dan S. LAVRIC, Dax M. CRUM, Oleg GOLONZKA, Tahir GHANI
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