Ic package providing isolated filter on lead-frame

An integrated circuit lead-frame package for an RF transceiver integrated circuit front end chip with integrated harmonic filter, comprising:

• a first metal die paddle and a laterally immediately adjacent and electrically separated second metal die paddle, wherein the first and second die paddles occupy a common plane, and
• an RF Front End Chip affixed to the first metal die paddle with an antenna output bond pad located on the side of the first metal die paddle that is laterally immediately adjacent to the second metal die paddle, and
• a Harmonic filter affixed to the second metal die paddle with a filter connection bond pad located on the side of the second metal die paddle that is laterally immediately adjacent to the first metal die paddle, and
• a bond wire directly connecting the antenna output bond pad to the filter connection bond pad, wherein the bond wire provides the minimum connection wire length between the two bond pads and is designed along with the Harmonic filter to present a 50 Ohm impedance to the RF Front End Chip, and
• a number of metal bond pad regions forming an outer ring of pads surrounding the adjacent first and second die paddles, wherein there are no metal bond pad regions between the adjacent die paddles but at least two of the metal bond pad regions connect to the first die paddle and at least two of the metal bond pad regions connect to the second die paddle.