US 2022/0093580 A1Published application

Fan-out led packaging structure and method

AssigneeSJ Semiconductor(Jiangyin) Corporation

InventorsHanlung Tsai, Xingtao Xue, Chengchung Lin

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Abstract

The present disclosure provides fan-out LED packaging structures and methods. The fan-out LED packaging structure at least comprises: an LED wafer, a packaging layer, a first redistribution layer, an IC control chip module, and a second redistribution layer. The LED wafer and the IC control chip module use metal wires of the first and second redistribution layers and metal-plated holes of the packaging layer to lead out and to control the LED wafer and the IC control chip. The present disclosure also provides fan-out LED packaging methods. The methods adopt metal plating in place of wire bonding, and adopt PI dielectric layers and rewiring layers in place of a base substrate, thus effectively reducing the LED package size.

Claims10

Dependent claims

A fan-out LED packaging structure, comprising:

an LED wafer comprising a first surface and a second surface, wherein the first surface is plated with LED electrodes;
a packaging layer enclosing a lateral side and the first surface of the LED wafer;
a first redistribution layer comprising a first PI dielectric layer and first metal wires disposed in the first PI dielectric layer, wherein the first redistribution layer comprises a first surface and a second surface opposite to the first surface, wherein the LED wafer is bonded to the second surface of the first redistribution layer, wherein the LED electrodes on the first surface of the LED wafer are connected to the first metal wires of the first redistribution layer, wherein the LED electrodes are made by means of perforated metal-plated electrodes disposed in the packaging layer;
an IC control chip module comprising an IC control chip, metal bumps, a thermally conductive adhesive and a heat sink, wherein the IC control chip comprises a first surface and a second surface opposite to the first surface, wherein the first surface comprises chip electrodes, wherein the metal bumps are formed on the chip electrodes of the first surface, wherein the thermally conductive adhesive and the heat sink are successively disposed on the second surface, wherein the IC control chip module is mounted to the second surface of the first redistribution layer by means of the metal bumps to electrically connect the LED wafer to the IC control chip module through the first redistribution layer;
and
a second redistribution layer comprising a second PI dielectric layer and second metal wires in the second PI dielectric layer, wherein the second redistribution layer is formed on the second surface of the LED wafer, wherein the second metal wires of the second redistribution layer are connected to the first metal wires of the first redistribution layer to lead out and control the LED wafer and the IC control chip.

3 more elements

A method of packaging a fan-out LED device, comprising steps of:

1) providing a support substrate;
2) forming a separation layer on the support substrate;
3) providing an LED wafer comprising a first surface and a second surface, wherein the first surface is plated with LED electrodes, and the second surface is attached to the separation layer such that the LED electrodes on the first surface of the LED wafer face away from the separation layer;
4) packaging the LED wafer with a packaging layer such that the first surface and a periphery of the LED wafer are enclosed by the packaging layer, wherein the packaging layer at the periphery of the LED wafer is in contact with the separation layer;
5) drilling holes in the packaging layer, wherein the holes expose portions of the first surface of the LED wafer and a surface of the separation layer;
6) plating LED electrodes in the holes such that a surface of the packaging layer, the exposed portions of the first surface of the LED wafer, and the exposed surface of the separation layer are covered by a continuous metal material;
7) forming a first redistribution layer on the packaging layer on the first surface of the LED wafer, wherein the first redistribution layer comprises a first PI dielectric layer and first metal wires, wherein the first PI dielectric layer and the first metal wires are stacked alternately, wherein the first PI dielectric layer also fills the holes at drilled locations of the packaging layer, wherein the first metal wires are connected to the LED electrodes exposed from the packaging layer;
8) peeling the support substrate off the packaged LED wafer, along with the separation layer, to expose the packaging layer, the LED electrodes at the drilled locations of the packaging layer, and the second surface of the LED wafer;
9) forming a second redistribution layer on the second surface of the LED wafer, wherein the second redistribution layer comprises a second PI dielectric layer and second metal wires disposed in the second PI dielectric layer, wherein the second metal wires of the second redistribution layer are connected to the first metal wires of the first redistribution layer to lead out the LED wafer and the LED electrodes;
and
10) surface mounting an IC control module with a heat sink to the first redistribution layer.

8 more elements

A fan-out LED packaging structure, comprising:

an IC control wafer module, the IC control wafer module comprising an IC control wafer, wherein the IC control wafer comprises a first surface and a second surface, wherein the first surface comprises chip electrodes connecting to metal lead posts, PI dielectric materials packaging the chip electrodes and the metal lead posts, and wherein top surfaces of the metal lead posts are configured to be exposed;
a first packaging layer enclosing a periphery of the IC control wafer module, wherein a thermally conductive adhesive and a heat sink are successively mounted to the second surface of the IC control wafer;
a first redistribution layer comprising a first PI dielectric layer and first metal wires disposed in the first PI dielectric layer, wherein the first redistribution layer comprises a first surface and a second surface opposite to the first surface, wherein the first metal wires run through the first redistribution layer from its first surface to its the second surface;
wherein the first metal wires are provided on the second surface, and wherein tall copper posts are formed on the first metal wires on the second surface;
wherein the IC control wafer module is tightly attached to the first surface of the first redistribution layer;
and wherein the metal lead posts of the IC control wafer module are connected to the first metal wires exposed from the first surface of the first redistribution layer;
an LED wafer module, the LED wafer module comprising an LED control wafer, the LED control wafer comprising a first surface and a second surface, the first surface having electrodes, the first surface having PI dielectric materials that packages the electrodes and metal lead posts, with top surfaces of the metal lead posts being exposed;
a second packaging layer enclosing the periphery of the LED wafer module and the periphery of the tall copper posts, wherein the first surface of the LED wafer is tightly attached to the second surface of the first redistribution layer;
the electrodes on the first surface of the LED wafer are connected with the first metal wires exposed on the second surface of the first redistribution layer and are connected to the IC control wafer module via the first metal wires;
and the electrodes on the first surface of the LED wafer are not connected with the first metal wires on the second surface of the first redistribution layer;
a second redistribution layer comprising a second PI dielectric layer and second metal wires in the second PI dielectric layer, wherein the second redistribution layer is formed on the second surface of the LED wafer, wherein the second metal wires connect the metal lead posts on the second surface of the LED wafer and the tall copper posts in the second packaging layer, and wherein the second metal wires lead out the IC wafer module through the tall copper posts and the first metal wires of the first redistribution layer;
and wherein the second metal wires on the surface of the second redistribution layer are configured for surface mounting of SMDs.

9 more elements

A method of packaging a fan-out LED device, comprising steps of:

1) providing a support substrate;
2) forming a separation layer on the support substrate;
3) providing an IC control wafer module comprising an IC control wafer, wherein the IC control wafer comprises a first surface and a second surface, wherein the first surface is provided with IC chip electrodes and metal lead posts;
and
die-bonding the second surface of the IC control wafer to the separation layer, wherein the chip electrodes on the first surface of the IC control wafer face away from the separation layer;
4) packaging the IC control wafer module with a first packaging layer, such that a periphery and a surface of the IC control wafer module facing away from the separation layer are enclosed by the first packaging layer, wherein the first packaging layer at the periphery of the IC control wafer module is in contact with the separation layer;
5) grinding the first packaging layer on the first surface of the IC control wafer such that the metal lead posts on the first surface of the IC control wafer module are exposed;
6) forming a first redistribution layer on a surface being ground in step 5), wherein the first redistribution layer comprises a first PI dielectric layer and first metal wires, wherein the first metal wires are connected to the metal lead posts on the first surface of the IC control wafer module;
7) forming tall copper posts at a portion of the first metal wires of the first redistribution layer to lead out the IC control wafer module;
8) providing an LED wafer module comprising an LED wafer, wherein the LED wafer comprises a first surface and a second surface, wherein the first surface is provided with LED electrodes, the second surface is provided with the metal lead posts;
and
die-bonding the first surface of the LED wafer to the first redistribution layer such that the LED electrodes on the first surface are connected to the first metal wires of the first redistribution layer, and wherein the metal lead posts on the second surface of the LED wafer face away from the first redistribution layer;
(9) packaging the first redistribution layer, the LED wafer module and the tall copper posts with a second packaging layer;
10) grinding the second packaging layer such that the metal lead posts on the first surface of the LED wafer and the tall copper posts on the first redistribution layer are exposed;
11) forming a second redistribution layer on a surface being ground on in step 10), wherein the second redistribution layer comprises a second PI dielectric layer and second metal wires, wherein the second metal wires are connected to the metal lead posts on the first surface of the LED wafer and top surfaces of the tall copper posts on the first redistribution layer;
12) stripping the support substrate at the separation layer to expose the second surface of the IC control wafer;
13) applying a thermally conductive adhesive on the second surface of the IC control wafer;
14) mounting a heat sink on the thermally conductive adhesive;
and
15) performing wafer cutting to obtain the fan-out LED device.

17 more elements

Dependencies are inferred from the claim text.