Semiconductor devices and methods of manufacturing semiconductor devices

A semiconductor device comprising:

• a base electronic component comprising:
• a base electronic component top side;
• a substrate comprising:
• a substrate top side;
• a substrate bottom side;
• a substrate dielectric structure between the substrate top side and the substrate bottom side;
• a substrate conductive structure comprising:
• conductive pads at the substrate bottom side;
• and
• conductive paths along the substrate dielectric structure and coupled to the conductive pads;
• and
• a substrate cavity through the substrate dielectric structure;
• short interconnects between the base electronic component top side and the substrate bottom side;
• a dam bounding a perimeter around the short interconnects;
• and
• tall interconnects adjacent to the dam between the base electronic component top side and the substrate bottom side, and coupled to the conductive pads of the substrate;
• and
• a mounted electronic component in the substrate cavity and coupled to the short interconnects;
• wherein:
• the substrate bottom side covers at least a portion of the dam without an electrical connection between a top side of the dam and the substrate bottom side.

A semiconductor device comprising:

• a base electronic component comprising:
• a base electronic component top side;
• a substrate comprising:
• a substrate bottom side;
• conductive pads at the substrate bottom side;
• and
• a substrate cavity;
• short interconnects between the base electronic component top side and the substrate bottom side;
• a dam bounding a perimeter of the short interconnects;
• and
• tall interconnects adjacent to the dam between the base electronic component top side and the substrate bottom side, and coupled to the conductive pads of the substrate;
• a mounted electronic component coupled to the short interconnects, wherein lateral sides of the mounted electronic component are bounded by the substrate cavity;
• a first underfill between the base electronic component and the mounted electronic component, wherein the first underfill contacts lateral portions of the short interconnects and the dam;
• and
• a second underfill between the base electronic component and the substrate bottom side, wherein the second underfill contacts the dam and the substrate bottom side.

A method comprising:

• providing a substrate comprising:
• a substrate bottom side;
• conductive pads at the substrate bottom side;
• and
• a substrate cavity;
• and
• coupling a stacked component structure with the substrate, the stacked component structure comprising a base electronic component comprising a base electronic component top side;
• wherein:
• short interconnects are between the base electronic component top side and the substrate bottom side;
• a dam bounds a perimeter of the short interconnects;
• and
• tall interconnects are adjacent to the dam between the base electronic component top side and the substrate bottom side, and coupled to the conductive pads of the substrate;
• a mounted electronic component is in the substrate cavity and coupled to the short interconnects;
• and
• the substrate bottom side covers at least a portion of the dam without an electrical connection between a top side of the dam and the substrate bottom side.