Method for fabricating semiconductor device with active interposer

Abstract

The present application discloses a method for fabricating a semiconductor device. The semiconductor device includes an active interposer including a programmable unit, a first memory die positioned above the active interposer and including a storage unit, and a first logic die positioned below the active interposer. The active interposer, the first memory die, and the first logic die are electrically coupled. method includes providing an active interposer comprising a programmable unit; providing a first logic die and bonding a first side of the active interposer onto the first logic die; providing a first memory die comprising a storage unit; and bonding the first memory die onto a second side of the active interposer, wherein the second side of the active interposer is parallel to the first side of the active interposer.

Dependencies are inferred from the claim text.