Ball grid array substrate

A system, comprising:

• an integrated circuit die (ICD) substrate having a top surface and a bottom surface;
• one or more integrated circuit dies attached to the top surface of the ICD substrate;
• a plurality of solder balls at least partially embedded in the bottom surface of the ICD substrate wherein the one or more dies are in electrical communication with the plurality of solder balls by way of the ICD substrate;
• a printed circuit board (PCB) substrate having a top surface including a plurality of cavities configured to store flux and to receive exposed surfaces of the plurality of solder balls;
• and
• a die attach film (DAF) disposed between and securing the ICD substrate and the PCB substrate, wherein the DAF comprises a plurality of openings that each correspond with one of the plurality of cavities.

An apparatus comprising:

• first substrate means having a top surface and a bottom surface;
• one or more integrated circuit dies attached to the top surface of the first substrate means;
• a plurality of solder balls embedded in a bottom surface of the first substrate means, wherein the one or more integrated circuit dies are in electrical communication with the plurality of solder balls by way of the first substrate means;
• second substrate means having a plurality of cavities in a top surface thereof;
• and
• means for adhering the bottom surface of the first substrate means with the top surface of the second substrate means.