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US 2022/0093569 A1Published application
Monolithic chip stacking using a die with double-sided interconnect layers
AssigneeIntel Corporation
InventorsAnup Pancholi, Kimin Jun
Life of this patent
Estimating the term…
Abstract
An apparatus is provided which comprises: a first die having a first surface and a second surface, the first die comprising: a first layer formed on the first surface of the first die, and a second layer formed on the second surface of the first die; a second die coupled to the first layer; and a plurality of structures to couple the apparatus to an external component, wherein the plurality of structures is coupled to the second layer.
Claims20
An apparatus comprising:
- a first die having a first surface and a second surface, the first die comprising:
- a first layer on the first surface, the first layer comprising one or more first interconnects;
- and
- a second layer on the second surface, the second layer comprising one or more second interconnects;
- a second die coupled to the first layer;
- a plurality of first structures coupled to the second die, wherein the second die is coupled to the first layer through the plurality of first structures;
- and
- a plurality of second structures to couple the apparatus to an external component, wherein the second structures are coupled to the second layer.
5 more elements
An apparatus comprising:
- a first die having a first surface and a second surface, the first die comprising:
- a first layer on the first surface, the first layer comprising one or more first interconnects;
- and
- a second layer on the second surface, the second layer comprising one or more second interconnects;
- a second die coupled to the first layer;
- a third layer coupled to the second layer, wherein the third layer comprises one or more redistribution structures;
- and
- a plurality of structures to couple the apparatus to an external component, wherein the structures are coupled to the second layer via the third layer.
5 more elements
An apparatus comprising:
- a first die having a first surface and a second surface, the first die comprising:
- a first layer on the first surface, the first layer comprising one or more first interconnects;
- and
- a second layer on the second surface, the second layer comprising one or more second interconnects;
- a second die coupled to the first layer;
- a third die between the first die and the second die, wherein the second die is coupled to the first layer via the third die;
- and
- a plurality of structures to couple the apparatus to an external component, wherein the structures are coupled to the second layer.
5 more elements
Dependencies are inferred from the claim text.