Stacked die and vr chiplet with dual-sided and unidirectional current flow

An electronic device, comprising:

• a package substrate, wherein the package substrate comprises an inductor;
• a first die over the package substrate, wherein the first die is a system-on-a-chip (SoC);
• and
• a second die with a first surface and a second surface, wherein the second die is a voltage regulation (VR) die, wherein current enters the second die from the first surface and exits the second die from the second surface, and wherein the second die is electrically coupled to the first die and the inductor.

A voltage regulator (VR) chiplet, comprising:

• a semiconductor substrate with a first surface and a second surface;
• integrated circuitry on the semiconductor substrate configured to provide a conversion of an input voltage to an output voltage;
• and
• wherein the first surface is configured to only receive current, and wherein the current is only to exit the semiconductor substrate through the second surface.

An electronic system, comprising:

• a board;
• a package substrate coupled to the board, wherein the package substrate comprises an inductor;
• a first die over the package substrate, wherein the first die is a system-on-a-chip (SoC);
• and
• a second die coupled to the package substrate and the first die, wherein the second die comprises a first surface and a second surface, wherein the second die is a voltage regulation (VR) die, and wherein current enters the second die from the first surface and exits the second die from the second surface.