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US 2022/0093562 A1Published application
Semiconductor device
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorHideaki KITAZAWA
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorHideaki KITAZAWA
Estimating the term…
There is provided a semiconductor device including a first electrode including a first plate portion, the first plate portion including a first surface and a second surface facing the first surface, a plurality of semiconductor chips provided above the second surface, and a second electrode including a second plate portion provided above the semiconductor chips, the second plate portion including a third surface facing the second surface and a fourth surface facing the third surface, the second plate portion including a plurality of protrusion portions provided between the semiconductor chips and the third surface, the protrusion portions being connected to the third surface, each of the protrusion portions including a top surface including the same shape as a shape of each of the semiconductor chips in a plane parallel to the second surface, the second plate portion including a second outer diameter larger than a first diameter of a smallest circle circumscribing the protrusion portions provided on an outermost side among the protrusion portions in a plane parallel to the third surface, and a third plate portion including a fifth surface connected to the fourth surface and a sixth surface facing the fifth surface, the third plate portion including a third outer diameter equal to or smaller than the first diameter.
A semiconductor device comprising:
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.