Integrated circuit packages and methods of forming the same

An integrated circuit package, comprising:

• a first redistribution structure and a second redistribution structure;
• a semiconductor layer between the first redistribution structure and the second redistribution structure;
• a plurality of conductive pillars disposed on the semiconductor layer and penetrating through the semiconductor layer, wherein the conductive pillars are disposed between and electrically connected to the first redistribution structure and the second redistribution structure;
• and
• a first die, wherein the first die is disposed on the semiconductor layer between the first redistribution structure and the second redistribution structure.

A method of manufacturing an integrated circuit package, comprising:

• forming a semiconductor layer on a first redistribution structure;
• forming a plurality of conductive pillars in the semiconductor layer to electrically connect to the first redistribution structure;
• forming a first die on the semiconductor layer between the conductive pillars;
• and
• forming a second redistribution structure on the semiconductor layer to electrically connect to the first die and the conductive pillars.