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US 2022/0093559 A1Published application
Reducing keep-out-zone area for a semiconductor device
AssigneeWestern Digital Technologies, Inc.
InventorsKevin Du, Hope Chiu, Zengyu Zhou, Alex Zhang, Vincent Jiang, Shixing Zhu, Paul Qu, Yi Su, Rui Yuan
Life of this patent
Estimating the term…
Abstract
A packaged semiconductor includes a substrate and a first component disposed on the substrate. The package includes an underfill that is dispensed under and around the first component. The package also includes a second component disposed on the substrate adjacent to the first component that provides a border to the underfill.
Claims20
A semiconductor device package, comprising:
- a substrate;
- a first component attached to a first major surface of the substrate;
- an underfill dispensed under and around the first component;
- and
- a second component attached to the first major surface adjacent to the first component,
- wherein the second component provides a border to the underfill.
3 more elements
A method of assembling a semiconductor package, the method comprising:
- attaching a first component to a first major surface of a substrate;
- attaching a second component to the first major surface of the substrate adjacent to a first side of the first component to provide a border to an underfill;
- and
- dispensing the underfill at the first side to cause the underfill to flow under and around the first component and abut the border.
1 more element
A semiconductor package comprising:
- a substrate having a first major surface;
- a flip chip die attached to the first major surface of the substrate;
- a first memory die attached to the first major surface of the substrate adjacent to a first side of the flip chip die;
- one or more second memory dies stacked on the first memory die;
- and
- an underfill material dispensed under the flip chip die,
- wherein a side of the first memory die adjacent to the flip chip die acts as a border to prevent flow of the underfill material.
4 more elements
Dependencies are inferred from the claim text.