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US 2022/0093558 A1Published application
Method of manufacturing electronic device
AssigneeInnolux Corporation
InventorsYi-An CHEN, Wan-Ling HUANG, Tsau-Hua HSIEH
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Abstract
A method of manufacturing an electronic device is disclosed. An electronic unit is provided. The electronic unit has a chip and at least one bonding pin. The electronic unit is mounted on the substrate through the at least one bonding pin, and an adhesive material is applied to a space between the chip and the substrate.
Claims6
A method of manufacturing an electronic device, comprising:
- providing a substrate;
- providing an electronic unit having a chip and at least one bonding pin;
- mounting the electronic unit on the substrate through the at least one bonding pin;
- and
- applying an adhesive material to a space between the chip and the substrate.
2 more elements
Dependencies are inferred from the claim text.