Chip-transferring system and chip-transferring method
AssigneeSkiileux Electricity Inc.
InventorChien-Shou Liao
Life of this patent
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Abstract
A chip-transferring system and a chip-transferring method are provided. The chip-transferring method includes: providing a chip carrying structure carrying an electronic chip; providing a circuit substrate, wherein a soldering material is configured between the electronic chip and the circuit substrate; providing a pin structure, wherein the electronic chip is transferred from the chip carrying structure to the circuit substrate through thrust of the pin structure; approaching a conductive coil structure of an eddy current generating module toward the soldering material , so that the soldering material is heated and cured indirectly through an eddy current generated by the conductive coil structure.
Claims16
A chip-transferring method, comprising:
- providing a chip carrying structure, wherein the chip carrying structure carries an electronic chip;
- providing a circuit substrate, wherein a soldering material is configured between the electronic chip and the circuit substrate;
- providing a pin structure, wherein the electronic chip is transferred from the chip carrying structure to the circuit substrate through thrust of the pin structure;
- approaching a conductive coil structure of an eddy current generating module toward the soldering material, such that an indirect heating of the soldering material is passed through an eddy current generated by the conductive coil structure and then cured.
A chip-transferring system, comprising:
- a pin structure;
- a chip carrying structure, carrying a chip group comprising a plurality of electronic chips;
- a substrate carrying module, carrying a circuit substrate, wherein the circuit substrate has a plurality of conductive pads;
- and
- an eddy current generating module, comprising a conductive coil structure and a controller electrically connected to the conductive coil structure,
- wherein an indirect heating of a soldering material between the electronic chip and the circuit substrate is passed through an eddy current generated by the conductive coil and then cured.
Dependencies are inferred from the claim text.