Asymmetric die bonding
AssigneeInternational Business Machines Corporation
InventorsKatsuyuki Sakuma, Krishna R. Tunga, Shidong Li, Griselda Bonilla
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Abstract
An integrated circuit package substrate (ICPS) system includes a die including a first array of connectors and a substrate including a second array of connectors that is configured to be thermocompression bonded to the first array of connectors at a bonding temperature that is above a solder melting temperature. The first die is bonded to the substrate such that the first die is asymmetric with respect to a substrate center, and the second array of connectors is adjusted, at an alignment temperature that is below the solder melting temperature, for thermal expansion to the bonding temperature with respect to a reference point that is not a first die center.
Claims20
An integrated circuit package substrate (ICPS) system comprising:
- a first die including a first array of connectors;
- and
- a substrate including a second array of connectors that is configured to be thermocompression bonded to the first array of connectors at a bonding temperature that is above a solder melting temperature;
- wherein the first die is bonded to the substrate such that the first die is asymmetric with respect to a substrate center;
- and
- wherein the second array of connectors is adjusted, at an alignment temperature that is below the solder melting temperature, for thermal expansion to the bonding temperature with respect to a reference point that is not a first die center.
A method of making an integrated circuit package substrate (ICPS) system, the method comprising:
- locating each connector in a first array of connectors on a die at a bonding temperature that is above a solder melting temperature;
- adjusting locations for each connector in a second array of connectors on a substrate at the alignment temperature with respect to a reference point that is not a die center such that the second array of connectors is aligned with a first array of connectors when the first array of connectors and the second array of connectors are at the bonding temperature;
- aligning the die and the substrate at an alignment temperature that is below the solder melting temperature such that the die is asymmetric with respect to a substrate center;
- heating the first array of connectors to the bonding temperature;
- heating the second array of connectors to the bonding temperature;
- and
- thermocompression bonding the die to the substrate.
An integrated circuit package substrate (ICPS) system comprising:
- a substrate having a first coefficient of thermal expansion, the substrate comprising a first array of connectors;
- and
- a first die having a second coefficient of thermal expansion that is different than the first coefficient of thermal expansion, the first die comprising a second array of connectors;
- wherein the first die is thermocompression bonded to the substrate by connecting the first array of connectors and the second array of connectors;
- wherein the first die is positioned asymmetrically with respect to a substrate center;
- and
- wherein the first array of connectors is thermally adjusted asymmetrically with respect to a first die center.
Dependencies are inferred from the claim text.