Semiconductor module
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorShun TAKEDA
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Abstract
A semiconductor module includes: a board; a semiconductor device disposed on the board, a first surface of the semiconductor device closer to the board being connected to the board; an interconnection layer to which a second surface of the semiconductor device opposite to the first surface is connected, and which has a recess portion on an opposite surface to a surface closer to the semiconductor device; a first metal film disposed in the recess portion of the interconnection layer via a bonding film, and that is electrically connected to the interconnection layer; an insulating layer disposed on the first metal film; and a heat transfer plate disposed on the insulating layer.
Claims18
A semiconductor module comprising:
- a board;
- a semiconductor device disposed on the board, the semiconductor device having a first surface facing the board and a second surface opposite to the first surface;
- an interconnection layer having a first interconnection layer surface facing the second surface of the semiconductor device, and a second interconnection layer surface opposite to the first interconnection layer surface, the second interconnection layer surface having a recess portion;
- a first metal film disposed on the recess portion via a bonding film, the first metal film being electrically connected to the interconnection layer;
- an insulating layer disposed on the first metal film;
- and
- a heat transfer plate disposed on the insulating layer.
Dependencies are inferred from the claim text.