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US 2022/0093548 A1Published application
Semiconductor package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsPei-Jen LO, Shun-Tsat TU, Cheng-En WENG
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Abstract
A semiconductor package is provided. The semiconductor package includes a first conductive layer, a plurality of first conductive pads, a plurality of second conductive pads, and a first dielectric layer. The first conductive pads are electrically connected to the first conductive layer. The second conductive pads are electrically disconnected from the first conductive layer.
Claims20
A semiconductor package, comprising:
- a first conductive layer;
- a plurality of first conductive pads electrically connected to the first conductive layer;
- a plurality of second conductive pads electrically disconnected from the first conductive layer.
A semiconductor package, comprising:
- a first semiconductor device;
- a plurality of first conductive pads under a projection area of an inner region of the first semiconductor device;
- and
- a plurality of second conductive pads under a projection area of a peripheral region of the first semiconductor device, the second conductive pads serving as an alignment mark.
1 more element
Dependencies are inferred from the claim text.