US 2022/0093547 A1 · MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

Abstract

Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component and a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes at least part of an inductor.

Claims20

Dependent claims

A microelectronic assembly, comprising:

a first microelectronic component having a direct bonding interface, wherein the first microelectronic component includes an inductor trace, and an interface portion of the inductor trace is at the direct bonding interface of the first microelectronic component;
and
a second microelectronic component having a direct bonding interface, wherein the direct bonding interface of the second microelectronic component is coupled to the direct bonding interface of the first microelectronic component.

Dependencies are inferred from the claim text.

Microelectronic assemblies with inductors in direct bonding regions

Life of this patent

Microelectronic assemblies with inductors in direct bonding regions

Life of this patent

Abstract

Claims20