Fan-out antenna packaging structure and packaging method

A fan-out antenna packaging structure, comprising:

• a rewiring layer, comprising a first surface and a second surface opposite to the first surface;
• a first antenna structure, located directly on the second surface of the rewiring layer and electrically connected to a metal wiring layer in the rewiring layer, wherein the first antenna structure comprises a first antenna metal connecting block, a first antenna metal connecting column, a first antenna packaging layer, and a first antenna metal layer, wherein the first antenna metal layer is aligned with the first antenna metal column which is aligned with the first antenna metal block;
• a second antenna structure disposed on the first antenna structure, wherein the second antenna structure comprises a second antenna metal connecting block, a second antenna metal connecting column, a second antenna packaging layer, and a second antenna metal layer, wherein the second antenna block overlays and in direct contact with the first antenna metal layer, wherein the second antenna metal layer is aligned with the second antenna metal column which is aligned with the second antenna metal block;
• a semiconductor chip located on the first surface of the rewiring layer, wherein a front surface of the semiconductor chip is electrically connected to the rewiring layer;
• a packaging layer, surrounding side surfaces and a bottom surface of the semiconductor chip and comprising a through hole that exposes the metal wiring layer;
• and
• a metal bump, electrically connected to the metal wiring layer through the through hole.