Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsChih-Hsien Chiu, Ko-Wei CHANG
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Abstract
An electronic package in which at least one magnetically permeable member is disposed between a carrier and an electronic component, where the electronic component has a first conductive layer, and the carrier has a second conductive layer, such that the magnetically permeable element is located between the first conductive layer and the second conductive layer. Moreover, a plurality of conductive bumps that electrically connect the first conductive layer and the second conductive layer are arranged between the electronic component and the carrier to surround the magnetically permeable member for generating magnetic flux.
Claims20
An electronic package, comprising:
- a carrier;
- an electronic component provided on the carrier;
- at least one magnetically permeable member provided between the carrier and the electronic component;
- and
- a conductor structure including a first conductive layer disposed on the electronic component, a second conductive layer disposed on the carrier, and a plurality of conductive bumps provided between the electronic component and the carrier, wherein the magnetically permeable member is located between the first conductive layer and the second conductive layer, and the plurality of conductive bumps are electrically connected with the first conductive layer and the second conductive layer.
A method of manufacturing an electronic package, comprising:
- providing an electronic component having a first conductive layer and a carrier having a second conductive layer;
- and
- disposing the electronic component on the carrier via a plurality of conductive bumps with at least one magnetically permeable member interposed between the electronic component and the carrier, wherein the plurality of conductive bumps are electrically connected with the first conductive layer and the second conductive layer, and the magnetically permeable member is located between the first conductive layer and the second conductive layer.
Dependencies are inferred from the claim text.