Magnetic core inductors in interposer
AssigneeIntel Corporation
InventorsKrishna BHARATH, William J. LAMBERT, Haifa HARIRI, Siddharth KULASEKARAN, Mathew MANUSHAROW, Anne AUGUSTINE
Life of this patent
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Abstract
Embodiments disclosed herein include coreless interposers with embedded inductors. In an embodiment, a coreless interposer comprises a plurality of buildup layers, where electrical routing is provided in the plurality of buildup layers. In an embodiment, the coreless interposer further comprises an inductor embedded in the plurality of buildup layers. In an embodiment, the inductor comprises a magnetic shell, and a conductive lining over an interior surface of the magnetic shell.
Claims25
A coreless interposer, comprising:
- a plurality of buildup layers, wherein electrical routing is provided in the plurality of buildup layers;
- and
- an inductor embedded in the plurality of buildup layers, wherein the inductor comprises:
- a magnetic shell;
- and
- a conductive lining over an interior surface of the magnetic shell.
A coreless interposer, comprising:
- a plurality of buildup layers wherein electrical routing is provided in the plurality of buildup layers;
- an inductor embedded in the plurality of buildup layers, wherein the inductor comprises:
- a first magnetic block;
- a second magnetic block, wherein the second magnetic block is connected to the first magnetic block by a first magnetic lid;
- a third magnetic block;
- a fourth magnetic block, wherein the fourth magnetic block is connected to the third magnetic block by a second magnetic lid;
- and
- a first plurality of conductive loops surrounding the second magnetic block;
- and
- a second plurality of conductive loops surrounding the third magnetic block.
A coreless interposer, comprising:
- a plurality of buildup layers, wherein electrical routing is provided in the plurality of buildup layers;
- and
- a transformer embedded in the plurality of buildup layers, wherein the transformer comprises:
- a row of magnetic blocks, wherein the row comprises a first magnetic block, a second magnetic block, and a third magnetic block;
- a plurality of primary windings around the second magnetic block;
- and
- a first plurality of secondary windings around the second magnetic block, wherein the primary windings and the secondary windings are in alternating buildup layers.
An electronic system, comprising:
- a board;
- a coreless interposer coupled to the board, wherein the coreless interposer comprises:
- an embedded inductor, comprising a magnetic shell with a conductive layer lining an interior surface of the magnetic shell;
- a coreless patch coupled to the coreless interposer;
- and
- a die coupled to the coreless patch.
Dependencies are inferred from the claim text.