Package-integrated bistable switch for electrostatic discharge (esd) protection

A package substrate of a microelectronic package, the package substrate comprising:

• a cavity in a layer of the package substrate;
• a switch configured to move within the cavity between an open position and a closed position;
• a first actuator configured to move the switch to the open position;
• and
• a second actuator configured to move the switch to the closed position,
• wherein:
• the switch is in contact with a ground connection in the open position and the closed position, and
• the switch is in contact with a signal connection in the closed position but not in the open position.

A microelectronic package, comprising:

• a die;
• and
• a package substrate coupled to the die on a first side, the package substrate comprising:
• a first interconnect on the first side electrically coupled to the die;
• a second interconnect on a second side opposite to the first side;
• and
• a switch located in a cavity of the package substrate between the first side and the second side,
• wherein:
• the switch is electrically coupled to the second interconnect and a ground connection,
• the switch is configured to move within the cavity between an open position and a closed position,
• in the open position, there is a conductive pathway between the first interconnect and the second interconnect, and
• in the closed position, there is a conductive pathway between the second interconnect and the ground connection.