Package structure and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorIan HU
Life of this patent
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Abstract
A package structure and a method for manufacturing the same are provided. The package structure includes a redistribution structure, a first electronic device, at least one second electronic device, a protection material, a heat dissipation structure and a reinforcement structure. The first electronic device is disposed on the redistribution structure. The second electronic device is disposed on the redistribution structure. The protection material is disposed between the first electronic device and the second electronic device. The heat dissipation structure is disposed on the first electronic device and the second electronic device. The reinforcement structure is disposed in an accommodating space between the heat dissipation structure and the protection material.
Claims20
A package structure, comprising:
- a redistribution structure;
- a first electronic device disposed on the redistribution structure;
- at least one second electronic device disposed on the redistribution structure;
- a protection material disposed between the first electronic device and the second electronic device;
- a heat dissipation structure disposed on the first electronic device and the second electronic device;
- and
- a reinforcement structure disposed in an accommodating space between the heat dissipation structure and the protection material.
A method for manufacturing a package structure, comprising:
- (a) providing a redistribution structure with a first electronic device, at least one second electronic device and a protection material, wherein the first electronic device and the second electronic device disposed on the redistribution structure, and the protection material is formed between the first electronic device and the second electronic device;
- (b) bonding a reinforcement structure to the protection material;
- and
- (c) attaching a heat dissipation structure to the reinforcement structure, the first electronic device and the second electronic device.
Dependencies are inferred from the claim text.