Semiconductor package with redistribution structure and manufacturing method thereof

A package, comprising:

• a die having an active surface and a backside surface opposite to the active surface;
• an encapsulant laterally surrounding the die;
• a redistribution structure disposed on the die and on the encapsulant, wherein the redistribution structure includes:
• a first dielectric layer;
• a first conductive trace disposed on the first dielectric layer;
• a first conductive via disposed in the first dielectric layer and in physical contact with the first conductive trace and the encapsulant;
• and
• a second conductive via disposed on the first conductive trace and vertically overlapping with the first conductive via;
• and
• a first connective terminal disposed on the redistribution structure and electrically connected to the die through the second conductive via, wherein a vertical projection of the first connective terminal overlaps with vertical projections of the first and second conductive vias.

A manufacturing method of a package, comprising:

• providing semiconductor dies, each semiconductor die having contacts exposed from a passivation layer located on an active surface of each semiconductor die;
• molding the semiconductor dies in an encapsulant;
• forming a redistribution structure on the semiconductor dies and on the encapsulant, wherein forming the redistribution structure comprises:
• forming a first dielectric layer having first openings above the semiconductor dies, second openings above the encapsulant and third openings, wherein the first openings expose the contacts, and the third openings expose at least one selected from the encapsulant and the passivation layer;
• depositing a conductive material over the first dielectric layer and filling into the first openings, the second openings and the third openings;
• and
• forming first conductive patterns, shielding plates and second conductive patterns respectively over the first openings, the second openings and the third openings;
• and
• dicing through the redistribution structure and the encapsulant along cutting lanes into individual packages.