Multiple component integration in fanout package with different back side metallization and thicknesses
AssigneeApple Inc.
InventorsKarthik Shanmugam, Jun Zhai
Life of this patent
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Abstract
One or more stud bumps may form a conductive column to a component having back side metallization. In an embodiment, the column of stud bumps may be about 130 um vertically (Z-direction). Providing a microelectronics package with a column of stud bumps electrically connected to a component having back side metallization may provide a cost effective electrical interconnect and may enable the incorporation of components of different thicknesses, including that the component thicknesses are independent of each other, in a single fanout package, while providing a thin package profile and back side surface finish integration.
Claims20
A package comprising:
- a first component, a second component, and a molding compound layer, the first component and the second component stacked back-to-back and encapsulated in the molding compound layer;
- a third component encapsulated in the molding compound layer;
- a front side wiring layer on and in electrical connection with the first component and the third component;
- an electrically conductive column including a plurality of stacked stud bumps extending from a back side of the third component and encapsulated in the molding compound layer, wherein the stud bumps of the plurality of stacked stud bumps are stacked directly on top of one another and the molding compound layer is in direct contact with the plurality of stacked stud bumps;
- and
- a back side wiring layer on and in electrical communication with the second component and the electrically conductive column.
A process of forming a package, the process comprising:
- placing first, second, and third components on a carrier, with the first and second components arranged back-to-back, and the third component including a back side metallization layer;
- forming a column of electrically conducting stud bumps on said third component metallization layer, wherein the electrically conducting stud bumps are stacked directly on top of one another;
- encapsulating said first, second, and third components, and said column of electrically conducting stud bumps, in a molding compound to form a molding compound layer, wherein the molding compound layer is in direct contact with the electrically conducting stud bumps;
- back grinding said molding compound layer to expose a portion of said column of electrically conducting stud bumps;
- and
- forming a wiring layer in direct electrical contact with said column of electrically conducting stud bumps.
Dependencies are inferred from the claim text.