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US 2022/0093522 A1Published application
Package integration using fanout cavity substrate
AssigneeApple Inc.
InventorsKarthik Shanmugam, Jun Zhai, Rajasekaran Swaminathan
Life of this patent
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Abstract
Packages and packaging techniques are described in which a patterned carrier substrate can be used to create a reconstituted fanout substrate with a topography that can accommodate components of different thicknesses. In an embodiment, a wiring layer is formed directly on a multiple level topography of a molding compound layer including embedded components.
Claims20
A package comprising:
- a first component encapsulated in a molding compound layer;
- wherein a topography of the molding compound layer includes a molded surface profile including a top surface, a floor surface, and mold sidewalls extending from the floor surface to the top surface;
- and
- a wiring layer formed over the top surface, the floor surface, and the mold sidewalls of the molded surface profile and directly on a first face of the first component along the top surface of the molded surface profile.
1 more element
A method of forming a package comprising:
- placing first components onto a lower surface of a carrier substrate, wherein the carrier substrate includes a raised surface and a lower surface and sidewalls extending between the lower surface and the raised surface;
- encapsulating the first components in a molding compound layer, wherein the molding compound layer laterally surrounds the first components between the sidewalls, and wherein a topography of the molding compound layer includes a molded surface profile including a top surface, a floor surface, and a plurality of mold sidewalls extending from the floor surface to the top surface;
- removing the carrier substrate and exposing the first components;
- and
- forming a wiring layer over the top surface, the floor surface, and the plurality of mold sidewalls of the molded surface profile and directly on first faces of the first components along the top surface.
2 more elements
(canceled)
Dependencies are inferred from the claim text.