US 2022/0093520 A1Published application

Conductive route patterning for electronic substrates

AssigneeIntel Corporation

InventorsJeremy D. Ecton, Aleksandar Aleksov, Brandon C. Marin, Yonggang Li, Leonel Arana, Suddhasattwa Nad, Haobo Chen, Tarek Ibrahim

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Abstract

Conductive routes for an electronic substrate may be fabricated by forming an opening in a material, using existing laser drilling or lithography tools and materials, followed by selectively plating a metal on the sidewalls of the opening. The processes of the present description may result in significantly higher patterning resolution or feature scaling (up to 2× improvement in patterning density/resolution). In addition to improved patterning resolution, the embodiments of the present description may also result in higher aspect ratios of the conductive routes, which can result in improved signaling, reduced latency, and improved yield.

Claims20

Dependent claims

An integrated circuit assembly, comprising:

a base substrate having a first surface;
a first conductive route, wherein the first conductive route, in cross-section, has a first end, a second end, and a center line extending between the first end and the second end, wherein the second end is adjacent the first surface of the base substrate, and wherein the center line is angled from a direction perpendicular to the first surface of the base substrate;
and
a second conductive route, wherein the second conductive route, in the same cross-section, has a first end, a second end, and a center line extending between the first end and the second end, wherein the second end is adjacent the first surface of the base substrate, and wherein the center line is angled off a direction perpendicular to the first surface of the base substrate;
wherein, in the cross-section, the first conductive route is substantially a mirror-image of the second conductive route.

2 more elements

A method of fabricating an integrated circuit assembly, comprising:

forming a base substrate having a first surface;
forming a material layer on the first surface of the base substrate;
forming an opening in the material layer, wherein the opening is defined by at least two opposing sidewalls;
forming a first conductive route on one of the sidewalls, wherein the first conductive route, in cross-section, has a first end, a second end, and a center line extending between the first end and the second end, wherein the second end is adjacent the first surface of the base substrate, and wherein the center line is angled from a direction perpendicular to the first surface of the base substrate;
and
forming a second conductive route on the sidewall opposing the sidewall upon which the first conductive route is formed, wherein the second conductive route, in the same cross-section, has a first end, a second end, and a center line extending between the first end and the second end, wherein the second end is adjacent the first surface of the base substrate, and wherein the center line is angled off a direction perpendicular to the first surface of the base substrate;
wherein, in the cross-section, the first conductive route is substantially a mirror-image of the second conductive route.

4 more elements

Dependencies are inferred from the claim text.