Interposers and semiconductor packages including the same

A semiconductor package, comprising:

• a first package substrate;
• a first semiconductor chip on the first package substrate;
• a first conductive connector on the first package substrate and isolated from direct contact with the first semiconductor chip;
• an interposer, the interposer including
• a central portion on the first semiconductor chip, and
• an outer portion contacting the first conductive connector;
• an insulating filler between the first package substrate and the interposer, the insulating filler being in contact with both the first semiconductor chip and the first conductive connector;
• a second conductive connector on the outer portion of the interposer;
• a second package substrate on the interposer through the second conductive connector;
• and
• a second semiconductor chip on the second package substrate,
• wherein a distance in a vertical direction between a bottom surface of the outer portion of the interposer and a top surface of the first package substrate is less than a distance in the vertical direction between a top surface of the first semiconductor chip and the top surface of the first package substrate, the vertical direction being perpendicular to the top surface of the first package substrate, and
• a top surface of the central portion of the interposer and a top surface of the outer portion of the interposer collectively define a groove in a top surface of the interposer at a border between the top surface of the central portion of the interposer and the top surface of the outer portion of the interposer.

An interposer for a semiconductor package, the interposer comprising:

• an outer portion including lower conductive pads at a bottom surface of the outer portion and upper conductive pads at a top surface of the outer portion;
• and
• a central portion protruding from the outer portion in a vertical direction that is perpendicular to the top surface of the outer portion, the central portion including a bottom surface defining a recess from the bottom surface of the outer portion in the vertical direction,
• wherein a thickness in the vertical direction of the outer portion is greater than a thickness in the vertical direction of the central portion, and
• a top surface of the central portion and the top surface of the outer portion collectively define a groove in a top surface of the interposer at a border between the top surface of the central portion and the top surface of the outer portion.